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DF160R12W2H3F_B11 IGBT

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Description

DF160R12W2H3F_B11 EasyPACK Modul mit schnellem Trench/Feldstopp High-Speed 3 IGBT und SiC Diode und PressFIT / NTC EasyPACK module with fast Trench/Fi.

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Features

* CoolSiC (TM) Schottky diode gen 5
* High speed IGBT H3
* Low switching losses
* thinQH SiC Schottky diode 1200V Mechanical Features
* 3 kV AC 1min insulation
* Al2O3 substrate with low thermal resistance
* Integrated NTC temperature sensor

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