F3L50R06W1E3_B11 Datasheet - Infineon

F3L50R06W1E3_B11 IGBT

Technische Information / Technical Information IGBT-Module IGBT-modules F3L50R06W1E3_B11 EasyPACK Modul mit Trench/Feldstopp IGBT3 und Emitter Controlled 3 Diode und PressFIT / NTC EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC J Typische Anwendungen 3-Level-Applikationen Solar Anwendungen USV-Systeme Elektrische Eigenschaften Niederinduktives Design Niedrige Schaltverluste Niedriges V.

F3L50R06W1E3_B11 Features

* Low inductive design

* Low Switching Losses

* Low VCEsat Mechanical Features

* Al2O3 Substrate with Low Thermal Resistance

* Compact design

* PressFIT Contact Technology

* Rugged mounting due to integrated mounting clamps Module Label Code B

F3L50R06W1E3_B11 Datasheet (824.12 KB)