F4-3L50R07W2H3F_B11 Datasheet - Infineon

F4-3L50R07W2H3F_B11, IGBT

F4-3L50R07W2H3F_B11 EasyPACK Modul mit schnellem Trench/Feldstopp High-Speed 3 IGBT und SiC Diode und PressFIT / NTC EasyPACK module with fast Trench/

Features

* CoolSiC (TM) Schottky diode gen 5
* High speed IGBT H3
* Low switching losses Mechanical Features
* 3 kV AC 1min insulation
* Al2O3 substrate with low thermal resistance
* Compact design
* PressFIT contact technology
* Rugged mounting

Applications

* 3-level-applications
* Motor drives
* Solar applications

F4-3L50R07W2H3F_B11-Infineon.pdf