FP10R12W1T7_B3

IGBT-Module

Infineon

FP10R12W1T7_B3 Features

* Electrical features - Low VCEsat - Overload operation up to 175°C - TRENCHSTOPTM IGBT7

* Mechanical features - Solder contact technology - Compact design - High power density - Al2O3 substrate with low thermal resistance - 2.5 kV AC 1 min insulation Potential applications

FP10R12W1T7_B3 General Description

J Datasheet www.infineon.com Please read the Important Notice and Warnings at the end of this document 0.10 2021-03-16 FP10R12W1T7_B3 EasyPIM™ module Table of contents Table of contents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..

FP10R12W1T7_B3 Datasheet (1.02 MB)