HYE18L128160BF-75 Datasheet, Mobile-RAM, Infineon

HYE18L128160BF-75 Features

  • Mobile-ram M O B I L E - R A M D E V I C E S come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon’s proprietary wire bonding Board-On-Chip (BOC) technology for sm

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Part number:

HYE18L128160BF-75

Manufacturer:

Infineon ↗

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569.46kb

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📄 Datasheet

Description:

Specialty drams mobile-ram.

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HYE18L128160BF-75 Application

  • Applications I N F I N E O N ’ S M O B I L E - R A M cuts power consumption by up to 80 % (depending on operating conditions and system design)

TAGS

HYE18L128160BF-75
Specialty
DRAMs
Mobile-RAM
Infineon

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