HYE18L256160BF-75 - Specialty DRAMs Mobile-RAM
HYE18L256160BF-75 Features
* M O B I L E - R A M D E V I C E S come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon’s proprietary wire bonding Board-On-Chip (BOC) technology for smallest form factors. The latest product generation further improves form factor by reducing package heights from 1.
