HYE18L256160BF-75 Datasheet - Infineon

HYE18L256160BF-75, Specialty DRAMs Mobile-RAM

Infineon Specialty DRAMs Mobile-RAM w w w.i n f i n e o n .c o m / m e m o r y / Mo b i l e - R A M Never stop thinking.Mobile-RAM * Ext.

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Datasheet Details

Part number:

HYE18L256160BF-75

Manufacturer:

Infineon ↗

File Size:

569.46 KB

Description:

Specialty DRAMs Mobile-RAM

Features

* M O B I L E - R A M D E V I C E S come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon’s proprietary wire bonding Board-On-Chip (BOC) technology for smallest form factors. The latest product generation further improves form factor by reducing package heights from 1.

Applications

* I N F I N E O N ’ S M O B I L E - R A M cuts power consumption by up to 80 % (depending on operating conditions and system design)

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HYE18L256160BF-75 Specialty DRAMs Mobile-RAM Infineon

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