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HYE18L128160BF-75 Datasheet - Infineon

HYE18L128160BF-75 DRAMs for Mobile Applications

HYE18L128160BF-75 Features

* M O B I L E - R A M D E V I C E S come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon’s proprietary wire bonding Board-On-Chip (BOC) technology for smallest form factors. The latest product generation further improves form factor by reducing package heights from 1.

HYE18L128160BF-75_InfineonTechnologiesAG.pdf

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Datasheet Details

Part number:

HYE18L128160BF-75

Manufacturer:

Infineon ↗

File Size:

569.46 KB

Description:

Drams for mobile applications.

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HYE18L128160BF-75 HYE18L128160BF-75 DRAMs for Mobile Applications Infineon

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