Part number:
HYE18L128160BF-75
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File Size:
569.46 KB
Description:
Drams for mobile applications.
HYE18L128160BF-75_InfineonTechnologiesAG.pdf
Datasheet Details
HYE18L128160BF-75 Features
* M O B I L E - R A M D E V I C E S come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon’s proprietary wire bonding Board-On-Chip (BOC) technology for smallest form factors. The latest product generation further improves form factor by reducing package heights from 1.
HYE18L128160BF-75_InfineonTechnologiesAG.pdf
Datasheet Details
HYE18L128160BF-75
569.46 KB
Drams for mobile applications.
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