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IRL3303L, IRL3303S HEXFET Power MOSFET

IRL3303L Description

PD - 9.1323B IRL3303S/L l l l l l l l Logic-Level Gate Drive Advanced Process Technology Surface Mount (IRL3303S) Low-profile through-hole (IRL3303L.
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area.

IRL3303L Features

* 4.78 (.188) 2.79 (.110) 2.29 (.090) 2.61 (.103) 2.32 (.091) 8.89 (.350) RE F. 1.78 (.070) 1.27 (.050) 1 3 3X 1.40 (.055) 1.14 (.045) 5.08 ( .200) 0.93 (.037) 3X 0.69 (.027) 0.25 (.010) M B A M 0.55 (.022) 0.46 (.018) 1.39 (.055) 1.14 (.045) MINIMUM RECO MM ENDED F OO TP RINT 11.43 (.450) N

IRL3303L Applications

* The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2 Pak is suitable for high current applications because of its low internal connection

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This datasheet PDF includes multiple part numbers: IRL3303L, IRL3303S. Please refer to the document for exact specifications by model.
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Datasheet Details

Part number
IRL3303L, IRL3303S
Manufacturer
International Rectifier
File Size
158.10 KB
Datasheet
IRL3303S_InternationalRectifier.pdf
Description
HEXFET Power MOSFET
Note
This datasheet PDF includes multiple part numbers: IRL3303L, IRL3303S.
Please refer to the document for exact specifications by model.

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HEXFET Power MOSFET International Rectifier
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