& APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805 size, with best EMI suppression effect but least impact to H
✔ WCM-2012HS Application
Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805 size, with be
WCM-2012HS-120T, KING CORE
SPECIFICATION OF WCM-HS SERIES
FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805 .
WCM-2012HS-240T, KING CORE
SPECIFICATION OF WCM-HS SERIES
FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805 .
WCM-2012HS-320T, KING CORE
SPECIFICATION OF WCM-HS SERIES
FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805 .
WCM-2012HS-670T, KING CORE
SPECIFICATION OF WCM-HS SERIES
FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805 .
WCM-2012HS-900T, KING CORE
SPECIFICATION OF WCM-HS SERIES
FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805 .
WCM-2012, KING CORE
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-120T, KING CORE
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-121T, KING CORE
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
