Description
6 512Mb Standard Interface 7
2.2.1 2.2.2 2.2.3 Pin/Ball Diagrams 7 System Interface 9 Signal Description 10 Ball Diagram 14 System Interface 15 Signal Description 16 Pin/Ball Diagram 18 System Interface 20 Signal Description 21 Ball Diagram 25 System Interface 26 Signal Description 27
2.3
1Gb Standard Interface 14
2.3.1 2.3.2 2.3.3
2.4
512Mb Multiplexed Interface 18
2.4.1 2.4.2 2.4.3
2.5
1Gb Multiplexed Interface 25
2.5.1 2.5.2 2.5.3
3. Theory of Operation 29 3.1 3.2 Overvi
Features
- High capacity: single die - 512Mb (64MB), dual die - 1Gb (128MB) Device cascade capacity: up to 2Gb (256MB)
Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 512Mb (64MB) capacity (single die): 48-pin TSOP-I package 85-ball FBGA 7x10 mm package 1Gb (128MB) capacity (dual die): 69-ball FBGA 9x12 mm package Enhanced performance by implementation of: Multi-plane operation DMA support MultiBurst operation Turbo operation Unriva.