Datasheet Details
Part number:
MD4832-Dxx, MD4331-Dxx_M
Manufacturer:
M-Systems
File Size:
879.86 KB
Description:
Mobile diskonchip g3 512mbit/1gbit flash disk.
Note:
This datasheet PDF includes multiple part numbers: MD4832-Dxx, MD4331-Dxx_M.
Please refer to the document for exact specifications by model.
MD4832-Dxx, MD4331-Dxx_M, Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk
6 512Mb Standard Interface 7 2.2.1 2.2.2 2.2.3 Pin/Ball Diagrams 7 System Interface 9 Signal Description 10 Ball Diagram 14 System Interface 15 Signal Description 16 Pin/Ball Diagram 18 System Interface 20 Signal Description 21 Ball Diagram 25 System Interface 26 Signal Description 27 2
Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk with MLC NAND and M-Systems’ x2 Technology Preliminary Data Sheet, June 2003 www.DataSheet4U.com Highlights Mobile DiskOnChip G3 is one of the industry’s most efficient storage solutions, using Toshiba’s 0.13 µm Multi-Level Cell (MLC) NAND flash technology and x2 technology from M-Systems®.
MLC NAND flash technology provides the smallest die size by storing 2 bits of information in a single memory cell.
x2 technology enables MLC NAND to achieve hi
MD4832-Dxx Features
* High capacity: single die - 512Mb (64MB), dual die - 1Gb (128MB) Device cascade capacity: up to 2Gb (256MB) Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 512Mb (64MB) capacity (single die): 48-pin TSOP-I package 85-ball FBG
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