MD4832-Dxx, MD4331-Dxx_M Datasheet - M-Systems

MD4832-Dxx Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk

6 512Mb Standard Interface 7 2.2.1 2.2.2 2.2.3 Pin/Ball Diagrams 7 System Interface 9 Signal Description 10 Ball Diagram 14 System Interface 15 Signal Description 16 Pin/Ball Diagram 18 System Interface 20 Signal Description 21 Ball Diagram 25 System Interface 26 Signal Description 27 2.

Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk with MLC NAND and M-Systems’ x2 Technology Preliminary Data Sheet, June 2003 www.DataSheet4U.com Highlights Mobile DiskOnChip G3 is one of the industry’s most efficient storage solutions, using Toshiba’s 0.13 µm Multi-Level Cell (MLC) NAND flash technology and x2 technology from M-Systems®. MLC NAND flash technology provides the smallest die size by storing 2 bits of information in a single memory cell. x2 technology enables MLC NAND to achieve hi.

MD4832-Dxx Features

* High capacity: single die - 512Mb (64MB), dual die - 1Gb (128MB) Device cascade capacity: up to 2Gb (256MB) Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 512Mb (64MB) capacity (single die): 48-pin TSOP-I package 85-ball FBG

MD4331-Dxx_M-Systems.pdf