MD4832-D512-V3Q18-X Datasheet - M-Systems

MD4832-D512-V3Q18-X Flash Memory

Updated RSRVD signal description Reference Section 2.2.3 Section 2.3.3 Section 2.4.3 DiskOnChip Control Register/Control Confirmation Register mapping corrected Icc * Active supply current updated Mechanical dimensions for 7x10 FBGA package updated 69-ball FBGA 9x12 daisy-chain ordering info.

www.DataSheet4U.com Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk with MLC NAND and M-Systems’ x2 Technology Preliminary Data Sheet, September 2003 Highlights Mobile DiskOnChip G3 is one of the industry’s most efficient storage solutions, using Toshiba’s 0.13 µm Multi-Level Cell (MLC) NAND flash technology and x2 technology from M-Systems. MLC NAND flash technology provides the smallest die size by storing 2 bits of information in a single memory cell. x2 technology enables MLC NAND to achiev.

MD4832-D512-V3Q18-X Features

* High capacity: single die - 512Mb (64MB), dual die - 1Gb (128MB) Device cascade capacity: up to 2Gb (256MB) Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 512Mb (64MB) capacity (single die): 48-pin TSOP-I package 85-ball FBG

MD4832-D512-V3Q18-X Datasheet (1.54 MB)