MD4832-D512-V3Q18-X-P, MD4832-D512-V3Q18-X-P_M Datasheet - M-Systems

Datasheet Details

Part number:

MD4832-D512-V3Q18-X-P, MD4832-D512-V3Q18-X-P_M

Manufacturer:

M-Systems

File Size:

1.54 MB

Description:

Flash Memory

Note:

This datasheet PDF includes multiple part numbers: MD4832-D512-V3Q18-X-P, MD4832-D512-V3Q18-X-P_M.
Please refer to the document for exact specifications by model.

Features

* High capacity: single die - 512Mb (64MB), dual die - 1Gb (128MB) Device cascade capacity: up to 2Gb (256MB) Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 512Mb (64MB) capacity (single die): 48-pin TSOP-I package 85-ball FBG

MD4832-D512-V3Q18-X-P_M-Systems.pdf

MD4832-D512-V3Q18-X-P Datasheet Preview — This datasheet PDF includes multiple part numbers: MD4832-D512-V3Q18-X-P, MD4832-D512-V3Q18-X-P_M. Please refer to the document for exact specifications by model.

MD4832-D512-V3Q18-X-P Datasheet Preview Page 2

MD4832-D512-V3Q18-X-P Datasheet Preview Page 3

MD4832-D512-V3Q18-X-P, MD4832-D512-V3Q18-X-P_M, Flash Memory

Updated RSRVD signal description Reference Section 2.2.3 Section 2.3.3 Section 2.4.3 DiskOnChip Control Register/Control Confirmation Register mapping corrected Icc * Active supply current updated Mechanical dimensions for 7x10 FBGA package updated 69-ball FBGA 9x12 daisy-chain ordering info

www.DataSheet4U.com Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk with MLC NAND and M-Systems’ x2 Technology Preliminary Data Sheet, September 2003 Highlights Mobile DiskOnChip G3 is one of the industry’s most efficient storage solutions, using Toshiba’s 0.13 µm Multi-Level Cell (MLC) NAND flash technology and x2 technology from M-Systems.

MLC NAND flash technology provides the smallest die size by storing 2 bits of information in a single memory cell.

x2 technology enables MLC NAND to achiev

MD4832-D512-V3Q18-X-P Distributor

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MD4832-D512-V3Q18-X-P_M Flash Memory M-Systems

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