SST11LF04 Datasheet PDF - Microchip High-Efficiency Front-end Module Specs

SST11LF04 - High-Efficiency Front-end Module

Datasheet Summary

Features

Input/output ports internally matched to 50 and DC decoupled.
Package available - 16-contact X2QFN.
2.5mm x 2.5mm x 0.4mm (max).
Devices are RoHS compliant Transmitter Chain.
Operating voltage 3.0V to 5.0V.
Gain: - Typically 30 dB gain across 4.9-5.9 GHz at 3.3V.
Typical linear output power at 3.3V: - Meets 802.11a OFDM ACPR requirement up to 21 dBm - Meets 802.11ac spectrum mask requirement up to 20 dBm - 3.0% dynamic EVM up to 18.

Datasheet Details

Part number	SST11LF04
Manufacturer	Microchip
File Size	470.60 KB
Description	High-Efficiency Front-end Module
Datasheet	SST11LF04 Datasheet
Additional preview pages of the SST11LF04 datasheet.

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Full PDF Text Transcription

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SST11LF04 4.9-5.9 GHz High-Linearity, High-Efficiency Front-end Module FEATURES • Input/output ports internally matched to 50 and DC decoupled • Package available - 16-contact X2QFN – 2.5mm x 2.5mm x 0.4mm (max) • Devices are RoHS compliant Transmitter Chain • Operating voltage 3.0V to 5.0V • Gain: - Typically 30 dB gain across 4.9-5.9 GHz at 3.3V • Typical linear output power at 3.3V: - Meets 802.11a OFDM ACPR requirement up to 21 dBm - Meets 802.11ac spectrum mask requirement up to 20 dBm - 3.0% dynamic EVM up to 18 dBm for 802.11a, 54 Mbps - 1.75% dynamic EVM up to 16 dBm for 802.11ac, MCS9, 80 MHz • Operating current for 802.11a/n/ac applications - 270 mA @ POUT = 18 dBm for 802.11a at 3.

Published: Jan 16, 2017 |