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MMBT2222LT1 - General Purpose Transistors

MMBT2222LT1 Description

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MMBT2222LT1/D General Purpose Transistors NPN Silicon 1 BASE COLLECTOR 3 MMBT2222LT1.

MMBT2222LT1 Features

* m preheating to soldering, the maximum temperature gradient shall be 5°C or less.
* After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradien

MMBT2222LT1 Applications

* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a

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Datasheet Details

Part number
MMBT2222LT1
Manufacturer
Motorola
File Size
253.60 KB
Datasheet
MMBT2222LT1_MotorolaInc.pdf
Description
General Purpose Transistors

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General Purpose Transistors Motorola
Motorola MMBT2222LT1-like datasheet