MMBT2222LT1 General Purpose Transistors

Motorola

Description

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MMBT2222LT1/D General Purpose Transistors NPN Silicon 1 BASE COLLECTOR 3 MMBT2222LT1.

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Datasheet Specifications

Part number: MMBT2222LT1
Manufacturer: Motorola
File Size: 253.60 KB
Datasheet: MMBT2222LT1_MotorolaInc.pdf
Description: General Purpose Transistors

Features

* m preheating to soldering, the maximum temperature gradient shall be 5°C or less.
* After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradien

Applications

* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a

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MMBT2222LT1 General Purpose Transistors Motorola

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