2SC4183 Datasheet - NEC

Features

* high gain, low noise, and excellent forward AGC characteristics in tiny plastic super mini mold package makes it suitable for use in small type equipments such as Hybrid Integrated Circuit and other applications. 2.0 ± 0.2 0.3 +0.1

* 0 PACKAGE DIMENSIONS in millimeters 2.1 ± 0.1 1.25 ± 0.1