D1264 Datasheet (NEC)

D1264, 2SD1264

of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples.

The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full r

D1264 Features

* a small resin insulated package, thus contributing to high-density mounting and mounting cost reduction. PACKAGE DRAWING (UNIT: mm) FEATURES

* High hFE and low VCE(sat): hFE ≅ 1,300 TYP. (VCE = 5.0 V, IC = 0.5 A) VCE(SAT) ≅ 0.3 V TYP. (IC = 2.0 A, IB = 20 mA)

* Full mold package th