IP4359CX4 - Dual channel low capacitance high performance ESD protection

Product Overview

NXP Semiconductors

Datasheet Details

Part number	IP4359CX4
Manufacturer	NXP Semiconductors
File Size	288.28 KB
Description	Dual channel low capacitance high performance ESD protection
Datasheet	IP4359CX4 Datasheet
Additional preview pages of the IP4359CX4 datasheet.

Product details

Description

The IP4359CX4 is a dual channel low capacitance ElectroStatic Discharge (ESD) protection device, providing protection to downstream components from ESD voltages as high as ±15 kV contact discharge and > ±15 kV air discharge according the IEC 61000-4-2 model, far exceeding standard level 4.

Features

Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant) 2 ultra low input capacity rail-to-rail ESD protection diodes with C(I/O-GND) = 1.3 pF Rdyn = 0.45 Ω Integrated ESD protection withstanding ±15 kV contact discharge and > ±15 kV air discharge, far exceeding IEC 61000-4-2 level 4.
Standard height version (0.61 mm) available as IP4359CX4/LF.
Reduced height version (maximum height of 0.5 mm) available as IP4359CX.

📁 Similar Datasheet

IP4302CX2A - Low profile bidirectional low capacitance ESD protection diode (NXP)
IP4309CX9 - HDMI octal channel low capacitive high-performance ESD protection (NXP)
IP431A - PROGRAMMABLE PRECISION REFERENCE (Sony Corporation)
IP4369CX4 - ESD protection (NXP)
IP4001 - DRAM Intelligent Memory Manager (Ingot)
IP4001S - 5-CH Motor Driver IC (Interpion Semiconductor)
IP4011 - 5-Ch Motor Drive IC (Interpion Semiconductor)
IP4035CX24 - 10-channel Integrated Filter Network (NXP)

Other Datasheets by NXP Semiconductors

IP4350CX24 - 9-channel SD memory card interface ESD protection filter to IEC 61000-4-2 level 4
IP4352CX24 - 9-channel SD memory card interface filter
IP4302CX2 - Low profile bidirectional low capacitance ESD protection diode
IP4337CX18 - 7-channel integrated filter network
IP4337CX18LF - 7-channel integrated filter network
IP4338CX24 - 10-channel integrated filter network

Published: Jan 3, 2011 |