OSD3358 - C-SiP Processor
17 5.2 Internal Use Only AM335x Signal Pins 20 5.3 Not Connected Balls 21 5.4 Reserved Signals 21 6 OSD335x C-SiP Components 22 6.1 AM335x Processor 23 6.1.1 I/O Voltages 23 6.1.2 Reset Circuitry 23 6.2 DDR3 Memory 24 6.3 MEMS Oscillator 25 6.4 eMMC 27 6.4.1 Powering the eMMC 27 6.4.2 Booti.
OSD335x C-SiP Family Rev. 9 10/5/2022 Introduction The OSD335x C-SiP System-In-Package (SiP) is a self-contained computing system ideal to power the latest embedded applications. It integrates the powerful 1GHz Sitara™ ARM® Cortex®-A8 AM335x Processor from Texas Instruments, up to 1 Gigabyte (GB) of DDR3L memory, up to 16 Gigabytes (GB) of embedded Multimedia Card (eMMC) non-volatile memory, a low power, low jitter MEMs Oscillator, 4 Kilobytes (KB) EEPROM, TPS65217C PMIC, TL5209 LDO, and resis.
OSD3358 Features
* TI AM335x, TPS65217C, TL5209, DDR3, EEPROM, eMMC, MEMS Oscillator and passive components integrated into a single package
* TI AM335x Features: o ARM® Cortex®-A8 up to 1GHz o 8 channel 12-bit SAR ADC o Ethernet 10/100/1000 x 2 o USB 2.0 HS OTG + PHY x2 o MMC, SD and SDIO x3 o LCD C