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No connection required for unlabeled bond pads Die thickness is 0.004 [0.10] Typical bond pad is 0.004 [0.10] square Backside metallization: Gold Backside is ground Bond pad metallization: Gold Pin Names and Descriptions Pin Name Des
SUF-1000 Cascadable pHEMT MMIC Amplifier DC to 20GHz RFMD’s SUF-1000 is a monolithically matched high IP3 broadband pHemt MMIC amplifier.
The self-biased directcoupled topology provides exceptional cascadable performance from DC to 20GHz.
Its efficient operation from a single 5V supply and its compact size (0.88mm x 0.75mm) make it ideal for high-density multi-chip module applications.
It is well suited for wideband instrumentation and directconversion systems.
Package: Die, 0.88mm x 0.75mm Fea
SUF-1000 Features
* Broadband Flat Gain = 10dB
* P1dB = 14dBm
* Direct-Coupled Topology
* Efficient Single-Supply Operation: 5V, 45mA
* Low Gain Variation versus Temperature
* Compact Die Size (0.75mm x 0.88m)
* Patented Self-Bias Darlington Applications
* Ultra-Broadband Communication
Datasheet Details
SUF-1000
RF Micro Devices
736.51 KB
Cascadable phemt mmic amplifier.
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