SUF-1000 Datasheet - RF Micro Devices

SUF-1000 Cascadable pHEMT MMIC Amplifier

(Dimensions in inches [millimeters]) Notes: 1. 2. 3. 4. 5. 6. No connection required for unlabeled bond pads Die thickness is 0.004 [0.10] Typical bond pad is 0.004 [0.10] square Backside metallization: Gold Backside is ground Bond pad metallization: Gold Pin Names and Descriptions Pin Name Des.

SUF-1000 Cascadable pHEMT MMIC Amplifier DC to 20GHz RFMD’s SUF-1000 is a monolithically matched high IP3 broadband pHemt MMIC amplifier. The self-biased directcoupled topology provides exceptional cascadable performance from DC to 20GHz. Its efficient operation from a single 5V supply and its compact size (0.88mm x 0.75mm) make it ideal for high-density multi-chip module applications. It is well suited for wideband instrumentation and directconversion systems. Package: Die, 0.88mm x 0.75mm Fea.

SUF-1000 Features

* Broadband Flat Gain = 10dB

* P1dB = 14dBm

* Direct-Coupled Topology

* Efficient Single-Supply Operation: 5V, 45mA

* Low Gain Variation versus Temperature

* Compact Die Size (0.75mm x 0.88m)

* Patented Self-Bias Darlington Applications

* Ultra-Broadband Communication

SUF-1000-RFMicroDevices.pdf

SUF-1000 Datasheet Preview — Preview of SUF-1000 PDF

Datasheet Details

Part number:

SUF-1000

Manufacturer:

RF Micro Devices

File Size:

736.51 KB

Description:

Cascadable phemt mmic amplifier.

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SUF-1000 SUF-1000 Cascadable pHEMT MMIC Amplifier RF Micro Devices

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