M6MGD13TW34DWG Datasheet (Renesas Technology)

M6MGD13TW34DWG, CMOS FLASH MEMORY

The M6MGD13TW34DWG is a Stacked Chip Scale Package The M6MGD13TW34DWG is suitable for a high performance cellular phone and a mobile PC that are required to be small (S-CSP) that contents 128M-bit Flash memory and 32M-bit mounting area, weight and small power dissipation.

Mobile RAM in a 72-pin Stac

M6MGD13TW34DWG Features

* Access Time Flash Mobile RAM Supply Voltage Ambient Temperature Package 70ns (Max.) 80ns (Max.) FM-VCC=2.7 ~ 3.0V Ta= -40 ~ 85 degree 72pin S-CSP, Ball pitch 0.80mm Outer-ball:Sn-Ag-Cu Application Mobile communication products PIN CONFIGURATION (TOP VIEW) INDEX(Laser Marking) 1 DU DU NC A5 A4 A0