M6MGD13TW66CWG-P Datasheet (Renesas Technology)

M6MGD13TW66CWG-P, CMOS FLASH MEMORY

The M6MGD13TW66CWG-P is a Stacked Chip Scale Package (S-CSP) that contents 128M-bit Flash memory and 64M-bit Mobile RAM in a 72-pin Stacked CSP with leaded solder ball.

128M-bit Flash memory is a 8,388,608 words, single power supply and high performance non-volatile memory fabricated by CMOS technol

M6MGD13TW66CWG-P Features

* Access Time Random Access/ Page Access Flash Mobile RAM Supply Voltage 70ns /25ns (Max.) 85ns /25ns (Max.) FM-VCC=2.7 ~ 3.0V Ta= -40 ~ 85 degree 72pin S-CSP, Ball pitch 0.80mm Outer-ball:Sn-Pb Ambient Temperature 64M-bit Mobile RAM is a 4,194,304 words high density RAM Package fabricated by CMOS te