Description
This product utilizes the 5th generation of design rules of ST’s proprietary STripFET™ technology.
Qg, in this chip scale package, makes this device suitable for the most demanding DC-DC converter applications, where high power density is to be achieved.
Features
- Type STK32N4LLH5.
- VDSS RDS(on) max RDS(on).
- Qg 40 V < 0.0025 Ω 106.4nC.
- mΩ
Ultra low top and bottom junction to case thermal resistance Extremely low on-resistance RDS(on) RDS(on).
- Qg industry benchmark High avalanche ruggedness Fully encapsulated die 100% Matte tin finish (in compliance with the 2002/95/EC european directive) PolarPAK® is a trademark of VISHAY Figure 1. Internal schematic diagram
PolarPAK®.
STK32N4LLH5_STMicroelectronics.pdf
