MR16R1622AF0 Datasheet (Samsung semiconductor) - (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die

MR16R1622AF0, (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die

Signal Pins A1, A3, A5, A7, A9, A11, A13, A15, A17, A19, A21, A23, A25, A27, A29, A31, A33, A39, A52, A60, A62, A64, A66, A68, A70, A72, A74, A76, A78, A80, A82, A84, A86, A88, A90, A92, B1, B3, B5, B7, B9, B11, B13, B15, B17, B19, B21, B23, B25, B27, B29, B31, B33, B39, B52, B60, B62, B64, B66, B68

MR16R1622(4/8/G)AF0 MR18R1622(4/8/G)AF0(1) Change History Version 1.1 (August 2001) First copy.

Based on the 1.0ver Rambus 256/288Mbit RIMM Module Datasheet Version 1.2 (February 2002) Add 1066-35 binning Version 1.3 (April 2002) Add 800-40 and 1066-32 binning Modify ∆TPD Value of AC electrical specifications Modify the Values of AC electrical specifications for RIMM Module Version 1.4 (July 2002) Add 1066-32 512MB (16d RIMM Module) etc.

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MR16R1622AF0 Features

* 256M x 16/18 -CN9 -CM8 -CK8

* High speed up to 1066 MHz RDRAM storage

* 184 edge connector pads with 1mm pad spacing

* Module PCB size : 133.35mm x 31.75mm x 1.27mm (5.25” x 1.25” x 0.05”) - 256Mb base RIMM Module

* Module PCB size : 133.35mm x 34.93mm x 1.27mm Fo