MR16R1624GEG0 Datasheet, Parameters, Samsung semiconductor

MR16R1624GEG0 Features

• Parameters
• High speed up to 1066 MHz RDRAM storage
• 184 edge connector pads with 1mm pad spacing
• Module PCB size : 133.35mm x 31.75mm x 1.27mm Form Factor The RIMM mo

PDF File Details

Part number:

MR16R1624GEG0

Manufacturer:

Samsung semiconductor

File Size:

485.61kb

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📄 Datasheet

Description:

Key timing parameters. Signal Pins A1, A3, A5, A7, A9, A11, A13, A15, A17, A19, A21, A23, A25, A27, A29, A31, A33, A39, A52, A60, A62, A64, A66, A68, A70, A

MR16R1624GEG0 Application

• Applications including computer memory, personal computers, workstations and other applications where high bandwidth www.DataSheet4U.com and low lat

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MR16R1624GEG0

Samsung semiconductor

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