MR16R1628DF0 Datasheet, Parameters, Samsung semiconductor

MR16R1628DF0 Features

  • Parameters
  • High speed up to 1066 MHz RDRAM storage
  • 184 edge connector pads with 1mm pad spacing
  • Module PCB size : 133.35mm x 31.75mm x 1.27mm (5.25” x 1.25” x 0.05”)

PDF File Details

Part number:

MR16R1628DF0

Manufacturer:

Samsung semiconductor

File Size:

442.47kb

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📄 Datasheet

Description:

(mr1xr1622(4/8/g)df0) key timing parameters. Signal Pins A1, A3, A5, A7, A9, A11, A13, A15, A17, A19, A21, A23, A25, A27, A29, A31, A33, A39, A52, A60, A62, A64, A66, A68, A70, A

Datasheet Preview: MR16R1628DF0 📥 Download PDF (442.47kb)
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MR16R1628DF0 Application

  • Applications including computer memory, personal computers, workstations and other applications where high bandwidth and low latency are required. T

TAGS

MR16R1628DF0
MR1xR16224
GDF0
Key
Timing
Parameters
Samsung semiconductor

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