MR16R162GAF0 Datasheet - Samsung semiconductor

MR16R162GAF0 (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die

Signal Pins A1, A3, A5, A7, A9, A11, A13, A15, A17, A19, A21, A23, A25, A27, A29, A31, A33, A39, A52, A60, A62, A64, A66, A68, A70, A72, A74, A76, A78, A80, A82, A84, A86, A88, A90, A92, B1, B3, B5, B7, B9, B11, B13, B15, B17, B19, B21, B23, B25, B27, B29, B31, B33, B39, B52, B60, B62, B64, B66, B68.

MR16R1622(4/8/G)AF0 MR18R1622(4/8/G)AF0(1) Change History Version 1.1 (August 2001) First copy. Based on the 1.0ver Rambus 256/288Mbit RIMM Module Datasheet Version 1.2 (February 2002) Add 1066-35 binning Version 1.3 (April 2002) Add 800-40 and 1066-32 binning Modify ∆TPD Value of AC electrical specifications Modify the Values of AC electrical specifications for RIMM Module Version 1.4 (July 2002) Add 1066-32 512MB (16d RIMM Module) etc. Page 0 Ver.

MR16R162GAF0 Features

* 256M x 16/18 -CN9 -CM8 -CK8

* High speed up to 1066 MHz RDRAM storage

* 184 edge connector pads with 1mm pad spacing

* Module PCB size : 133.35mm x 31.75mm x 1.27mm (5.25” x 1.25” x 0.05”) - 256Mb base RIMM Module

* Module PCB size : 133.35mm x 34.93mm x 1.27mm Fo

MR16R162GAF0 Datasheet (419.61 KB)

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Datasheet Details

Part number:

MR16R162GAF0

Manufacturer:

Samsung semiconductor

File Size:

419.61 KB

Description:

(mr1xr1622(4/8/g)af0) (16mx16)x2(4/8/16)pcs rimm module based on 256mb a-die.

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MR16R162GAF0 MR1xR16224 GAF0 16Mx16x24 16pcs RIMM Module based 256Mb A-die Samsung semiconductor

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