MR18R1622AF0 Datasheet, A-die, Samsung semiconductor

MR18R1622AF0 Features

• A-die 256M x 16/18 -CN9 -CM8 -CK8
• High speed up to 1066 MHz RDRAM storage
• 184 edge connector pads with 1mm pad spacing
• Module PCB size : 133.35mm x 31.75mm x 1

PDF File Details

Part number:

MR18R1622AF0

Manufacturer:

Samsung semiconductor

File Size:

419.61kb

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📄 Datasheet

Description:

(mr1xr1622(4/8/g)af0) (16mx16)x2(4/8/16)pcs rimm module based on 256mb a-die. Signal Pins A1, A3, A5, A7, A9, A11, A13, A15, A17, A19, A21, A23, A25, A27, A29, A31, A33, A39, A52, A60, A62, A64, A66, A68, A70, A

MR18R1622AF0 Application

• Applications including computer memory, personal computers, workstations and other applications where high bandwidth and low latency are required. T

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