MR18R1624AF0, MR16R1622AF0 Datasheet - Samsung semiconductor

MR18R1624AF0 (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die

Signal Pins A1, A3, A5, A7, A9, A11, A13, A15, A17, A19, A21, A23, A25, A27, A29, A31, A33, A39, A52, A60, A62, A64, A66, A68, A70, A72, A74, A76, A78, A80, A82, A84, A86, A88, A90, A92, B1, B3, B5, B7, B9, B11, B13, B15, B17, B19, B21, B23, B25, B27, B29, B31, B33, B39, B52, B60, B62, B64, B66, B68.

MR16R1622(4/8/G)AF0 MR18R1622(4/8/G)AF0(1) Change History Version 1.1 (August 2001) First copy. Based on the 1.0ver Rambus 256/288Mbit RIMM Module Datasheet Version 1.2 (February 2002) Add 1066-35 binning Version 1.3 (April 2002) Add 800-40 and 1066-32 binning Modify ∆TPD Value of AC electrical specifications Modify the Values of AC electrical specifications for RIMM Module Version 1.4 (July 2002) Add 1066-32 512MB (16d RIMM Module) etc. Page 0 Ver.

MR18R1624AF0 Features

* 256M x 16/18 -CN9 -CM8 -CK8

* High speed up to 1066 MHz RDRAM storage

* 184 edge connector pads with 1mm pad spacing

* Module PCB size : 133.35mm x 31.75mm x 1.27mm (5.25” x 1.25” x 0.05”) - 256Mb base RIMM Module

* Module PCB size : 133.35mm x 34.93mm x 1.27mm Fo

MR16R1622AF0_Samsungsemiconductor.pdf

MR18R1624AF0 Datasheet Preview — This datasheet PDF includes multiple part numbers: MR18R1624AF0, MR16R1622AF0. Please refer to the document for exact specifications by model.

Datasheet Details

Part number:

MR18R1624AF0, MR16R1622AF0

Manufacturer:

Samsung semiconductor

File Size:

419.61 KB

Description:

(mr1xr1622(4/8/g)af0) (16mx16)x2(4/8/16)pcs rimm module based on 256mb a-die.

Note:

This datasheet PDF includes multiple part numbers: MR18R1624AF0, MR16R1622AF0.
Please refer to the document for exact specifications by model.

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TAGS

MR18R1624AF0 MR16R1622AF0 MR1xR16224 GAF0 16Mx16x24 16pcs RIMM Module based 256Mb A-die Samsung semiconductor

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