* 256M x 16/18 -CN9 -CM8 -CK8
* High speed up to 1066 MHz RDRAM storage
* 184 edge connector pads with 1mm pad spacing
* Module PCB size : 133.35mm x 31.75mm x 1.27mm (5.25” x 1.25” x 0.05”) - 256Mb base RIMM Module
* Module PCB size : 133.35mm x 34.93mm x 1.27mm Fo
MR18R162GAF0 Datasheet (419.61 KB)
MR18R162GAF0
Samsung semiconductor
419.61 KB
(mr18r1622(4/8/g)af0) (16mx16)x2(4/8/16)pcs rimm module based on 256mb a-die.
MR16R1622(4/8/G)AF0 MR18R1622(4/8/G)AF0(1)
Change History
Version 1.1 (August 2001)
* First copy.
* Based on the 1.0ver Rambus 256/288Mbit RIM.
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