* High speed up to 1066 MHz RDRAM storage
* 184 edge connector pads with 1mm pad spacing
* Module PCB size : 133.35mm x 34.93mm x 1.27mm
* Each RDRAM device has 32 banks, for a total of 512
* Gold plated edge connector pad contacts
* Serial Presence De
MR18R326GAG0 Datasheet (259.11 KB)
MR18R326GAG0
Samsung semiconductor
259.11 KB
(32mx18) 16pcs rimm module based on 576mb a-die.
MR18R326GAG0
Change History
Version 1.0 (Mar. 2004)
* First copy.
* Based on the 1.0 ver. (July 2002) 256/288Mbit D-die RIMM Module Datasheet.
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