GN25L95
Semtech
1.64MB
2.5 gbps cmos burst mode laser driver & limiting post amplifier. The GN25L95 is a combined burst mode laser driver and limiting post amplifier designed for fiber optic transceiver modules. The GN25L
TAGS
📁 Related Datasheet
GN20 - GN Package XX-Lead Plastic SSOP
(ETC)
( DataSheet : .. )
GN Package 16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.045 ± .005
.189 – .196* (4..
GN2011 - GaAs N-Channel MES IC
(Panasonic)
( DataSheet : .. )
..
.
GN2012 - GaAs MMIC
(Panasonic)
.
GN2470 - INSULATED GATE BIPOLAR TRANSISTOR
(Supertex)
Insulated Gate Bipolar Transistor
Features
► Low voltage drop at high currents ► Industry standard TO-252 (D-Pak) package ► 700V breakdown voltage rat.
GN2A - GLASS PASSIVATED JUNCTION SILICON SURFACE MOUNT
(EIC discrete Semiconductors)
GN2A - GN2M
PRV : 50 - 1000 Volts Io : 2.0 Amperes
FEATURES :
* * * * * Glass passivated chip High current capability High reliability Low reverse cur.
GN2B - GLASS PASSIVATED JUNCTION SILICON SURFACE MOUNT
(EIC discrete Semiconductors)
GN2A - GN2M
PRV : 50 - 1000 Volts Io : 2.0 Amperes
FEATURES :
* * * * * Glass passivated chip High current capability High reliability Low reverse cur.
GN2D - GLASS PASSIVATED JUNCTION SILICON SURFACE MOUNT
(EIC discrete Semiconductors)
GN2A - GN2M
PRV : 50 - 1000 Volts Io : 2.0 Amperes
FEATURES :
* * * * * Glass passivated chip High current capability High reliability Low reverse cur.
GN2G - GLASS PASSIVATED JUNCTION SILICON SURFACE MOUNT
(EIC discrete Semiconductors)
GN2A - GN2M
PRV : 50 - 1000 Volts Io : 2.0 Amperes
FEATURES :
* * * * * Glass passivated chip High current capability High reliability Low reverse cur.
GN2J - GLASS PASSIVATED JUNCTION SILICON SURFACE MOUNT
(EIC discrete Semiconductors)
GN2A - GN2M
PRV : 50 - 1000 Volts Io : 2.0 Amperes
FEATURES :
* * * * * Glass passivated chip High current capability High reliability Low reverse cur.
GN2K - GLASS PASSIVATED JUNCTION SILICON SURFACE MOUNT
(EIC discrete Semiconductors)
GN2A - GN2M
PRV : 50 - 1000 Volts Io : 2.0 Amperes
FEATURES :
* * * * * Glass passivated chip High current capability High reliability Low reverse cur.