1SS133M Datasheet - Taiwan Semiconductor

1SS133M Hermetically Sealed Glass Switching Diodes

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1SS133M Features

* - Fast switching device (trr < 4.0 ns) - Through-hole mount device type - DO-34 package (JEDEC DO-204) - Hermetically sealed glass - Compression bonded construction - All external surfaces are corrosion resistant and leads are readily solderable - RoHS compliant - Solder hot dip Tin (Sn) lead finish

1SS133M-TaiwanSemiconductor.pdf