Datasheet Specifications
- Part number
- TGF1350
- Manufacturer
- TriQuint Semiconductor
- File Size
- 467.76 KB
- Datasheet
- TGF1350_TriQuintSemiconductor.pdf
- Description
- Discrete MESFET
Description
Product Data Sheet Discrete MESFET TGF1350-SCC Key .
Features
* and PerformanceApplications
* DC to 18 GHz. Bond pad is gold plated for compatibility with thermocompression and thermosonic compatibility wire-bonding processes. The TGF1350-SCC is readily assembled using automated equipment. Die attach should be accomplished with conductive epoxy only. Eutectic attach is not recommended . TriTGF1350 Distributors
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