MADS-001317-1320AG - GaAs Solder Bump Flip Chip Schottky Diode
M/A-COM’s MADS-001317-1320AG is a Gallium Arsenide Flip-Chip Schottky diode with solder bumps.
These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics.
This device can be used up to 80 GHz.
This diode is fully passivated
