WCMC2016V1X Datasheet - Weida Semiconductor

128K x 16 Pseudo Static RAM DIE

WCMC2016V1X General Description

Die (25-30 mil) in wafer form. Die (14 mil) in wafer form. Die (11 mil) in wafer form. Min 617 320 252 Nom 685 355 280 Max 754 391 308 Unit µm µm µm www.DataSheet4U.com Weida Semiconductor, Inc. 38-xyxyx Revised August 22, 2001 ADVANCE INFORMATION Bond Pad Locations 64 1 2 3 4 5 6 7 8 9 10 11 12.

WCMC2016V1X Datasheet (167.62 KB)

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WCMC2016V1X

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Weida Semiconductor

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167.62 KB

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128k x 16 pseudo static ram die.
ADVANCE INFORMATION General Physical Specification WCMC2016V1X 128K x 16 Pseudo Static RAM DIE Substrate Connection Req.: Ground Wafer Diameter [mm].

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WCMC2016V1X 128K Pseudo Static RAM DIE Weida Semiconductor

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WCMC2016V1X General Description

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