* 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS 7 3.1 Pad Configuration WSON 8x6-mm 7 3.2 Pad Description WSON 8x6-mm 7 3.3 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) 8 3.4 Ball Description TFBGA 8x6-mm 8 4. PIN DESCRIPTIONS 9 4.1 Serial MCP (SpiStack®) Device Configuration 9 4.2 Chip S
W25M02GW
Winbond
1.38 MB
1.8v 2g-bit serial slc nand flash memory.
W25M02GW
Featuring
1.8V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH
DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS
Public.
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W25M02GV
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3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS
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W25M121AV - SERIAL MCP FLASH MEMORY
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W25M121AV
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SERIAL MCP FLASH MEMORY
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W25M161AV - SERIAL MCP FLASH MEMORY
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W25M161AV
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SERIAL MCP FLASH MEMORY
With Multi I/O SPI & Concurrent Operations 3V 16M-bit Serial NOR Flash Memory & 3V 1G-bit Serial NAND Flas.
W25M321AV - SERIAL MCP FLASH MEMORY
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W25M321AV
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SERIAL MCP FLASH MEMORY
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W25M512JV - 3V 512M-BIT SERIAL MCP FLASH MEMORY
(Winbond)
W25M512JV
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3V 512M-BIT (2 x 256M-BIT) SERIAL MCP FLASH MEMORY
With Multi I/O SPI & Concurrent Operations
Publication Release Date: September .
W25M512JW - 1.8V 512M-BIT SERIAL MCP FLASH MEMORY
(Winbond)
W25M512JW
Featuring
1.8V 512M-BIT (2 x 256M-BIT) SERIAL MCP FLASH MEMORY
With Multi I/O SPI & Concurrent Operations
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W2512 - Precision Thin Film Chip Resistors
(TT electronics)
Precision Thin Film Chip Resistors
PFC Series • Standard 60/40 Sn/Pb and Pb-free (RoHS pliant) terminations available • Available in 0402, 0603, 08.
W255 - 200-MHz 24-Output Buffer
(Cypress Semiconductor)
W255
200-MHz 24-Output Buffer for 4 DDR or 3 SDRAM DIMMS
Features
Functional Description
• One input to 24-output buffer/driver • Supports up to 4.
