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W25M512JW

1.8V 512M-BIT SERIAL MCP FLASH MEMORY

W25M512JW Features

* 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS 7 3.1 Pad Configuration WSON 8x6-mm 7 3.2 Pad Description WSON 8x6-mm 7 3.3 Pin Configuration SOIC 300-mil 8 3.4 Pin Description SOIC 300-mil 8 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) 9 3.6 Ball Description TFBGA 8x6-mm 9 4. DEVICE C

W25M512JW Datasheet (1.47 MB)

Preview of W25M512JW PDF

Datasheet Details

Part number:

W25M512JW

Manufacturer:

Winbond

File Size:

1.47 MB

Description:

1.8v 512m-bit serial mcp flash memory.
W25M512JW Featuring 1.8V 512M-BIT (2 x 256M-BIT) SERIAL MCP FLASH MEMORY With Multi I/O SPI & Concurrent Operations Publication Release Date: December.

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W25M512JW 1.8V 512M-BIT SERIAL MCP FLASH MEMORY Winbond

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