* 3 3. PACKAGE TYPES AND PIN CONFIGURATIONS 4 3.1 Pad Configuration WSON 8x6-mm 4 3.2 Pad Description WSON 8x6-mm 4 4. DEVICE CONFIGURATION & PIN DESCRIPTIONS 5 4.1 Serial MCP (SpiStack®) Device Configuration 5 4.2 Chip Select (/CS) 5 4.3 Serial Input & Output (DI, DO and IO0, IO1, IO2, IO3) 5 4.4
W25M321AV
Winbond
3.18 MB
Serial mcp flash memory.
W25M321AV
Featuring
SERIAL MCP FLASH MEMORY
With Multi I/O SPI & Concurrent Operations 3V 32M-bit Serial NOR Flash Memory & 3V 1G-bit Serial NAND Flas.
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SERIAL MCP FLASH MEMORY
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W25M512JV - 3V 512M-BIT SERIAL MCP FLASH MEMORY
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W2512 - Precision Thin Film Chip Resistors
(TT electronics)
Precision Thin Film Chip Resistors
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W255 - 200-MHz 24-Output Buffer
(Cypress Semiconductor)
W255
200-MHz 24-Output Buffer for 4 DDR or 3 SDRAM DIMMS
Features
Functional Description
• One input to 24-output buffer/driver • Supports up to 4.
