CPZ28 Datasheet - centralsemi

CPZ28 0.5 Watt Zener Diode

PROCESS Zener Diode CPZ28 0.5 Watt Zener Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 13 x 13 MILS 7.8 MILS 7.0 x 7.0 MILS Ti/Al - 13,000Å Au-As - 13,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 101,184 PRINCIPAL DEVICE TYPES CMPZ5221B THRU CMPZ5267B R0 BACKSIDE CATHODE R2 (22-March 2010) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com PROCESS CPZ28 Typical Electrical Character.

CPZ28 Datasheet (493.41 KB)