PROCESS CPZ39R Transient Voltage Suppressor 5 Volt Quad TVS Chip PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Areas (4) Top Side Metalization Back Side Metalization 11 x 11 MILS 3.94 MILS 3.54 MILS DIAMETER EACH Al - 30,000Å Au - 9,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 140,490 PRINCIPAL DEVICE TYPE CMNTVS5V0 R0 (22-January 2013) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com PROCESS CPZ39R Typical Electrical Characteristics R0 (22-January 2013) w w w. .