PROCESS 12 Volt TVS Chip CPZ37R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization 6.7 x 6.7 MILS 3.54 MILS 4.3 x 4.3 MILS Al - 13,000Å Au-As/Ag - 13,000Å/6,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 368,512 PRINCIPAL DEVICE TYPE CTLTVS12 R0 (16-March 2012) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com .
