PROCESS 5 Volt TVS Chip CPZ40X Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization Back Side Metalization 13.4 x 13.4 MILS 5.5 MILS 3.9 x 6.7 MILS Al - 30,000Å Au - 9,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 122,493 PRINCIPAL DEVICE TYPE CMO5V0LC R0 (9-January 2013) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com PROCESS CPZ40X Typical Electrical Characteristics R0 (9-January 2013) w w w. c e n t r a l s e m.
