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AT68166F - Rad Hard 16 MegaBit 3.3V SRAM MultiChip Module

Datasheet Summary

Description

The AT68166F/G is a 16Mbit SRAM packaged in a hermetic Multi Chip Module (MCM) for space applications.

The AT68166F/G MCM incorporates four 4Mbit AT60142FT SRAM dice.

It can be organized as either one bank of 512Kx8, two banks of 512Kx16 or four banks of 512Kx8.

Features

  • 16 www. DataSheet4U. com Mbit SRAM Multi Chip Module Allows 32-, 16- or 8-bit access configuration Operating Voltage: 3.3V + 0.3V Access Time.
  • 20 ns, 18 ns for AT68166F.

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Datasheet preview – AT68166F

Datasheet Details

Part number AT68166F
Manufacturer ATMEL Corporation
File Size 359.37 KB
Description Rad Hard 16 MegaBit 3.3V SRAM MultiChip Module
Datasheet download datasheet AT68166F Datasheet
Additional preview pages of the AT68166F datasheet.

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Full PDF Text Transcription

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Features • • • • • • • • • • • • • • • 16 www.DataSheet4U.com Mbit SRAM Multi Chip Module Allows 32-, 16- or 8-bit access configuration Operating Voltage: 3.3V + 0.3V Access Time – 20 ns, 18 ns for AT68166F – <18 ns for AT68166G (in development prototypes in Q4 2007) Power Consumption – Active: 620 mW per byte (Max) @ 18ns - 415 mW per byte (Max) @ 50ns (1) – Standby: 13 mW (Typ) Military Temperature Range: -55 to +125°C TTL-Compatible Inputs and Outputs Asynchronous Die manufactured on Atmel 0.25 µm Radiation Hardened Process No Single Event Latch Up below LET Threshold of 80 MeV/mg/cm2 Tested up to a Total Dose of 300 krads (Si) according to MIL-STD-883 Method 1019 ESD Better than 4000V Quality Grades: – QML-Q or V with SMD 5962-06229 – ESCC 950 Mils Wide MQFP 68 Package Mass : 8.
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