Advanced Semiconductor ULBM25
ULBM25 is Designed for PACKAGE STYLE .500 6L FLG FEATURES: • • • Omnigold™ Metalization System D C A 2x ØN FULL R B E .725/18,42 F K M L MAXIMUM inches / mm MAXIMUM RATINGS IC VCBO VCEO VCES VEBO PDISS TJ TSTG θ JC O G 4.8 A 36 V 16 V 36 V 4.0 V 70 W @ TC = 25 OC -65 C to +200 C -65 OC to +150 OC 2.5 OC/W O DIM A B C D E F G H I J K L M N H MINIMUM inches / mm J I .150 / 3.43 .045 / 1.14 .210 / 5.33 .835 / 21.21 .200 / 5.08 .490 / 12.45 .003 / 0.08 .125 / 3.18 .725 / 18.42 .970 / 24.64 .090 / 2.29 .150 / 3.81 .160 / 4.06 .220 / 5.59 .865 / 21.97 .210 / 5.33 .510 / 12.95 .007 / 0.18 .980 /...DESCRIPTION
: The ASI ULBM25 is Designed for PACKAGE STYLE .500 6L FLGFEATURES
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● Omnigold™ Metalization System D C A 2x ØN FULL R B E .725/18,42 F K M L MAXIMUM inches / mm