MTP2301N3 Description
CYStech Electronics Corp. 2004.04.05 Revised Date :2018.08.31 Page No.
MTP2301N3 Key Features
- Advanced trench process technology
- High density cell design for ultra low on resistance
- Excellent thermal and electrical capabilities
- pact and low profile SOT-23 package
- Pb-free lead plating and halogen-free package