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CY7C1166V18 Datasheet

Manufacturer: Cypress (now Infineon)
CY7C1166V18 datasheet preview

Datasheet Details

Part number CY7C1166V18
Datasheet CY7C1166V18_CypressSemiconductor.pdf
File Size 1.20 MB
Manufacturer Cypress (now Infineon)
Description (CY7C11xxV18) 18-Mbit DDR-II SRAM 2-Word Burst Architecture
CY7C1166V18 page 2 CY7C1166V18 page 3

CY7C1166V18 Overview

The DDR-II+ consists of an SRAM core with an advanced synchronous peripheral circuitry. Addresses for read and write are latched on alternate rising edges of the input (K) clock. Write data is registered on the rising edges of both K.

CY7C1166V18 Key Features

  • Functional Description
  • SRAM uses rising edges only Echo clocks (CQ and CQ) simplify data capture in high-speed systems Data valid pin (QVLD) to
  • HSTL inputs and Variable drive HSTL output buffers
  • Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
  • Offered in both Pb-free and non Pb-free packages
  • 2M x 8
  • 2M x 9
  • 1M x 18 CY7C1170V18
  • 512K x 36
  • 198 Champion Court
Cypress (now Infineon) logo - Manufacturer

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CY7C11651KV18 18-Mbit QDR II SRAM 4-Word Burst Architecture
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CY7C1165V18 (CY7C11xxV18) SRAM 4-Word Burst Architecture
CY7C1168KV18 18-Mbit DDR II+ SRAM Two-Word Burst Architecture

CY7C1166V18 Distributor

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