• Part: GP800FSS12
  • Description: Powerline N-Channel Single Switch IGBT Module Preliminary Information
  • Manufacturer: Dynex Semiconductor
  • Size: 89.13 KB
Download GP800FSS12 Datasheet PDF
Dynex Semiconductor
GP800FSS12
GP800FSS12 is Powerline N-Channel Single Switch IGBT Module Preliminary Information manufactured by Dynex Semiconductor.
FEATURES s s s s s s s (See package details for further information) Fig. 1 Electrical connections - (not to scale) 3/4(E) n - Channel Enhancement Mode High Input Impedance Optimised For High Power High Frequency Operation Isolated Base Full 1200V Capability 800A Per Module 8(E1) 9(G1) 1/2(C) 7(C1) Fig.2 Single switch circuit diagram APPLICATIONS s s s s ORDERING INFORMATION Order As: GP800FSS12 Note: When ordering, please use the plete part number. High Power Switching Motor Control Inverters Traction Systems Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 1/11 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may inlcude potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Tcase = 25˚C unless stated otherwise. Symbol VCES VGES IC Parameter Collector-emitter voltage Gate-emitter voltage Collector current DC, Tcase = 25˚C DC, Tcase = 75˚C IC(PK) Pmax Visol Maximum power dissipation Isolation voltage 1ms, Tcase = 75˚C Tcase = 25˚C (Transistor) moned terminals to base plate. AC RMS, 1 min, 50Hz VGE = 0V Test Conditions Max. 1200 ±20 1050 800 1600 6000 2500 Units V V A A A W V THERMAL AND MECHANICAL RATINGS Symbol Rth(j-c) Rth(j-c) Rth(c-h) Tj Parameter Thermal resistance - transistor Thermal resistance - diode Thermal resistance - Case to heatsink (per module)...