FDZ4670 Description
bining Farichild’s 30V PowerTrench process with state-ofthe-art BGA packaging, the FDZ4670 minimize both PCB space and rDS(on) . This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to bine excellent thermal transfer characteristics, high current handing capacity, ultra-low profile packaging, low gate charge and low rDS(on).
FDZ4670 Key Features
- Max rDS(on) = 2.5mΩ at VGS = 10V, ID = 25A
- Max rDS(on) = 4.5mΩ at VGS = 4.5V, ID = 18.5A
- Outstanding thermal transfer characteristics
- Ultra-low gate charge x rDS(on) product
- RoHS pliant