FDZ4670S Description
bining Fairchild's 30V PowerTrench® process with state-of-the-art BGA packaging, the FDZ4670S minimizes both PCB space and rDS(on). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to bine excellent thermal transfer characteristics, high current handling capacity, ultra-low profile packaging, low gate charge and low rDS(on) incorporating SyncFET technology. This device has the...
FDZ4670S Key Features
- Max rDS(on) = 2.4mΩ at VGS = 10V, ID = 25A
- Max rDS(on) = 4.0mΩ at VGS = 4.5V, ID = 19A
- Outstanding thermal transfer characteristics
- Ultra-low gate charge x rDS(on) product
- RoHS pliant